一、个人基本情况

姓名: 郑怀

性别:

出生年月: 1988-01-07

学历:博士

职称:讲师

E-mail huai_zheng@whu.edu.cn

二、学习及工作经历

2006-2010年,于华中科技大学获 热能与动力工程专业 学士学位

2010-2014年,于华中科技大学获 工程热物理专业 博士学位

2015-至今, 武汉大学任 讲师

三、学术和社会兼职情况

担任Optics Express IEEE Transactions on Components, Packaging and Manufacturing Technology等国际期刊审稿人。

四、主要研究方向

微尺度传热传质、电子封装、微/纳器件加工

五、开设课程

六、近年的科研项目、专著与论文、专利、获奖

1、 科研项目

目前无负责项目

2、代表性论著和教材

Ø 期刊论文

[1] Huai Zheng, Lan Li, Xiang Lei, Xingjian Yu, Sheng Liu, and Xiaobing Luo, Optical Performance Enhancement for Chip-on-Board Packaging LEDs by Adding TiO2/Silicone Encapsulation Layer, IEEE Electron Device Letters, Vol. 35(10), 1046-1048, 2014. (SCI)

[2] Huai Zheng, Yiman Wang, Lan Li, Xing Fu, Yong Zou, and Xiaobing Luo, Dip-transfer phosphor coating on designed substrate structure for high angular color uniformity of white light emitting diodes with conventional chips, Optics Express, Vol. 21, 933-941, 2013. (SCI)

[3] Huai Zheng, Sheng Liu and Xiaobing Luo, Enhancing Angular color uniformity of phosphor-converted white light-emitting diodes by Phosphor dip-transfer coating, IEEE Journal of Lightwave Technology, Vol. 31(12), 1987-1993, 2013. (SCI)

[4] Huai Zheng, Jinlong Ma and Xiaobing Luo, Conformal Phosphor Distribution for White Lighting Emitting Diode Packaging by Conventional Dispensing Coating Method with Structure Control, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 3(3), 417-421, 2013. (SCI)

[5] Huai Zheng and Xiaobing Luo, Correlated Color Temperature Consistency Enhancement of White Light-emitting Diodes through Substrate Structure Design, IEEE Photonics Technology Letters, Vol. 25(5), 484-487, 2013. (SCI)

[6] Xiaobing Luo, Xing Fu, Fei Chen, Huai Zheng, Phosphor self-heating in phosphor converted light emitting diode packaging, International Journal of Heat and Mass Transfer, Vol. 58, 276-281, 2013. (SCI)

[7] Run Hu, Zhiqiang Gan, Xiaobing Luo, Huai Zheng, and Sheng Liu, Design of double freeform-surface lens for LED uniform illumination with minimum Fresnel losses, Optik – International Journal of Light and Electron Optics, Vol. 124, pp. 3895– 3897, 2013. (SCI)

[8] Run Hu, Huai Zheng, Jinyan Hu, and Xiaobing Luo,Comprehensive study on the transmitted and reflected light through the phosphor layer in light-emitting diode packages, IEEE Journal on Display Technology, vol. 9(6), 447-452, 2013. (SCI)

[9] Huai Zheng, Xiaobing Luo, Run Hu, Bin Cao, Xing Fu, Yiman Wang, Conformal phosphor coating using capillary microchannel for controlling color deviation of phosphor-converted white light-emitting diodes, Optics Express, Vol. 20(5), 5092–5098, 2012. (SCI)

[10] Run Hu, Xiaobing Luo, and Huai Zheng, Hotspot location shift in the high power phosphor converted white light-emitting diode package, Japanese Journal of Applied Physics 51 (2012) 09MK05. (SCI)

[11] Run Hu, Xiaobing Luo, Huai Zheng, Zong Qin, Zhiqiang Gan, Bulong Wu, and Sheng Liu, Design of a novel freeform lens for LED uniform illumination and conformal phosphor coating, Optics Express, Vol. 20(13), 13727-13737, 2012. (SCI)

[12] Bulong Wu, Huai Zheng, Xing Fu, and Xiaobing Luo, Effect of Gold Wire Bonding on Optical Performance of High Power Light-emitting Diode Packaging, Journal of Ceramic Processing Research, Vol. 13, S351-S354, 2012. (SCI)

[13] Xiaobing Luo, Huai Zheng, Minglu Liu, Sheng Liu, Experimental Study on Substrate with Hierarchical Nested Channels for Thermal Interface Resistance Control, Journal of Applied Physics, 098109, 2011. (SCI) (导师作为第一作者)

[14] Bulong Wu, Xiaobing Luo, Huai Zheng, and Sheng Liu, Effect of gold wire bonding process on angular correlated color temperature uniformity of white light-emitting diode, Optics Express, Vol. 19 (24), 24115–24121, 2011.(SCI)

Ø 会议论文

[1] Huai Zheng, Ling Xu, Yiman Wang, Sheng Liu, and Xiaobing LuoMechanism Investigation on Die Tilt in Die Attach ProcessThe 14th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Florida, USA, May 27- 30, 2014. (Accepted) (EI)

[2] Huai Zheng, Zhili Zhao, Yiman Wang, Lang Li, Sheng Liu, and Xiaobing LuoEffect of Patterned Substrate on Light Extraction Efficiency of Chip-on-Board Packaging LEDsThe 64th Electronic Components and Technology Conference, Florida, USA, May 27- 30, 2014. (Accepted) (EI)

[3] Huai Zheng, Yiman Wang, Xing Fu, Sheng Liu, and Xiaobing Luo, Conformal phosphor coating for phosphor-converted white LEDs on basis of dispensing process,  14th International Conference on Electronic Packaging Technology & High Density Packaging, Dalian, China, pp. 1138-1141, 2013. (Oral Presentation) (EI)

[4] Huai Zheng, Yiman Wang, Ling Xu, Sheng Liu and Xiaobing Luo, Effect of die shape on die tilt in die attach process, 14th International Conference on Electronic Packaging Technology & High Density Packaging, Dalian, China, pp. 651-655, 2013. (Oral Presentation) (EI)

[5] Huai Zheng, Xing Fu, Bulong Wu, Sheng Liu, and Xiaobing Luo, A method for geometry control of phosphor layer in high-power white LEDs by package structure, IEEE International Conference on Electronics Materials and Packaging pp. 246-250, 2012, Hong Kong. (Oral Presentation) (EI)

[6] Huai Zheng, Xing Fu, Run Hu, Sheng Liu and Xiaobing Luo, Angular Color Uniformity Improvement for Phosphor-converted White Light-Emitting Diodes by Optimizing Remote Coating Phosphor Geometry, 13th International Conference on Electronic Packaging Technology & High Density Packaging, Guilin, China, 2012, PP:1483-1486. (Oral Presentation) (EI)

[7] Xing Fu, Huai Zheng, Sheng Liu and Xiaobing Luo, Optical Study of Phosphor Converted Light Emitting Diodes with Given Correlated Color Temperatures, 13th International Conference on Electronic Packaging Technology & High Density Packaging, Guilin, China, 2012, PP:1479-1482.(EI)

[8] Run Hu, Huai Zheng, Chuangang Ji, Sheng Liu, Xiaobing Luo, A Method to Design Freeform Lens for Uniform Illumination in Direct-Lit LED Backlight with High Distance-Height Ratio, 13th International Conference on Electronic Packaging Technology & High Density Packaging, Guilin, China, 2012, PP:1474-1478.(EI)

[9] Run Hu, Zhangming Mao, Huai Zheng, Quan Chen, Sheng Liu and Xiaobing Luo, A Compact Thermal Model to Predict the Junction Temperature of High Power Light Emitting Diode Package, The 62th Electronic Components and Technology Conference, San Diego, CA, USA, May 29-June 2, 2012. pp: 1781-1785. (EI)

[10] Huai Zheng, Jinlong Ma, Xiaobing Luo and Sheng Liu, Precise Model of Phosphor Geometry Formed in Dispensing Process of LED Packaging, 12th International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, 2011, PP:1077-1080.(EI)

3、授权专利

[1] 罗小兵,郑怀,余珊,陈明祥,一种反光杯及其LED封装中控制荧光粉层几何形状的方法,ZL 2011.1.0123454.4

[2] 罗小兵,郑怀,付星,刘胜,利用表面改性实现无透镜封装的LED封装器件及其方法,ZL 2011.1.0396568.6

[3] 罗小兵,郑怀,付星,王依蔓,袁超,一种基板结构及其用于二极管封装中荧光粉涂覆,ZL 2012.1.0253752.X

4、荣誉与奖励

20013.10 荣获博士生国家奖学金

2013.10 荣获华中科技大学2012-2013年度学科贡献奖

2012.10 荣获华中科技大学2011-2012年度单项奖

2010.6 华中科技大学优秀毕业生称号

2009.10 获本科生国家奖学金

2007-2010 连续年获得华中科技大学学习优秀奖

2007-2010 连续年获得华中科技大学三好学生称号