吴国强  教授、博导

主要研究方向

MEMS谐振器与振荡器、惯性MEMS传感器、非制冷红外MEMS传感器、MEMS/NEMS传感器与微系统

教育经历

2008-2013，工学博士，中科院上海微系统与信息技术研究所

研究方向：单晶硅体模态微机械谐振器及其应用的研究

导师：王跃林研究员（973首席科学家）

2004-2008，工学学士，西安电子科技大学

专业：电子科学与技术

工作经历

2018/11-至今，教授，武汉大学青年学术带头人，武汉大学工业科学研究院

主要从事微型定位导航授时系统（Micro-PNT）的研究工作

2014/11-2018/10，研究员，独立项目负责人，新加坡科技局微电子研究院

作为独立项目负责人（PI，Principle Investigator），主持含政府企业合作、企业资助及政府资助等科研项目共4项，总计科研经费超过560万新币（约2800万人民币）。

单片集成惯性传感器平台，项目负责人，2014-2017，355.6万新币；

高精度MEMS陀螺仪，项目负责人，2014-2016，131.1万新币；

应用于极端环境的表面声学波压力传感器，共同项目负责人，2018-2019，58.6万新币；

键合界面温度传感器的研发，项目负责人，2018-2020，21.5万新币。

2013/8-2014/9，研发工程师，中航工业自控所惯性MEMS传感器的研究与工艺集成

期刊论文

Guoqiang Wu^#,*, Beibei Han^#, Daw Don Cheam^#, Eva Wai Leong Ching, Peter Hyun Kee Chang, and Yuandong Gu, “Development Of 6-Degree-of-Freedom (DOF) Inertial Sensors With A 8-inch Advanced MEMS Fabrication Platform,” IEEE Trans. Ind. Electron., (online published) (SCI, IF: 7.168)

Guoqiang Wu^#,*, Jinghui Xu^#, Xiaolin Zhang, Nan Wang, Danlei Yan, Jayce Lay Keng Lim, Yao Zhu, Wei Li, and Yuandong Gu, “Wafer-Level Vacuum-Packaged High Performance AlN-on-SOI Piezoelectric Resonator for Sub-100 MHz Oscillator Applications,” IEEE Trans. Ind. Electron., vol. 65, no. 4, pp. 3576-3584, Apr. 2018. (SCI, IF: 7.168)

Jinghui Xu^#, Kevin Tshun-Chuan Chai^#, Guoqiang Wu^#, Eva Leong-Ching Wai, Wei Li, Jason Yeo, Edwin Nijhof, and Yuandong Gu*, “Low Cost, Tiny Sized MEMS Hydrophone Sensor For Water Pipeline Leak Detection,” IEEE Trans. Ind. Electron., (online published) (SCI, IF: 7.168)

Guoqiang Wu*, Geng Li Chua, Navab Singh, and Yuandong Gu, “A Quadruple Mass Vibrating MEMS Gyroscope With Symmetric Design,” IEEE Sensors Letters, vol. 2, no. 4, p. 2501404, Dec. 2018.

Guoqiang Wu*, Geng Li Chua, and Yuandong Gu, “A dual-mass fully decoupled MEMS gyroscope with wide bandwidth and high linearity,” Sens. Actuators A: Phys., vol 259, pp. 50-56, Mar. 2017. (SCI, IF: 2.499)

Guoqiang Wu, Yao Zhu, Srinivas Merugu, Nan Wang, Chengliang Sun*, and Yuandong Gu, “GHz spurious mode free AlN lamb wave resonator with high figure of merit using one dimensional phononic crystal tethers,” Appl. Phys. Lett., vol. 109, no. 1, pp. 013506, Jul. 2016. (SCI, IF: 3.411)

Guoqiang Wu*, Dehui Xu, Bin Xiong, Lufeng Che, and Yuelin Wang, “Design, fabrication and characterization of a resonant magnetic field sensor based on mechanically coupled dual-microresonator,” Sens. Actuators A: Phys., vol. 248, pp. 1-5, Jul. 2016. (SCI, IF: 2.499)

Guoqiang Wu, Dehui Xu*, Xiao Sun, Bin Xiong, and Yuelin Wang, “Wafer-Level Vacuum Packaging for Microsystems Using Glass Frit Bonding,” IEEE Trans. Comp. Packag. Technol., vol. 3, no. 10, pp. 1640-1646, Oct. 2013. (SCI, IF: 1.581)

Guoqiang Wu, Dehui Xu*, Bin Xiong, Duan Feng and Yuelin Wang, “Resonant Magnetic Field Sensor With Capacitive Driving and Electromagnetic Induction Sensing,” IEEE Electron Device Lett., vol. 34, no. 3, pp. 459-461, Mar. 2013. (SCI, IF: 3.048)

Guoqiang Wu*, Dehui Xu, Bin Xiong, and Yuelin Wang, “Effect of air damping on quality factor of bulk mode microresonators,” Microelectronic Engineering, vol. 103, pp. 86-91, Mar. 2013. (SCI, IF: 1.806)

Guoqiang Wu*, Dehui Xu, Bin Xiong, Yuchen Wang, Yuelin Wang, and Yinglei Ma, “Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding,” J. Microelectromech. Syst., vol. 21, no. 6, pp. 1484-1491, Dec. 2012. (SCI, IF: 2.124)

Guoqiang Wu, Dehui Xu*, Bin Xiong, and Yuelin Wang, “Wheatstone bridge piezoresistive sensing for bulk-mode micromechanical resonator,” Appl. Phys. Lett., vol. 101, no. 19, p. 193505, Nov. 2012. (SCI, IF: 3.411)

Guoqiang Wu*, Dehui Xu, Bin Xiong, and Yuelin Wang, “Redistribution of Electrical Interconnections for Three-Dimensional Wafer-Level Packaging With Silicon Bumps,” IEEE Electron Device Lett., vol. 33, no. 8, pp. 1177-1179, Aug. 2012. (SCI, IF: 3.048)

Guoqiang Wu*, Dehui Xu, Bin Xiong, and Yuelin Wang, “High Q Single Crystal Silicon Micromechanical Resonators With Hybrid Etching Process,” IEEE Sensors J., vol. 12, no. 7, pp. 2414-2415, Jul. 2012. (SCI, IF: 2.512)

Guoqiang Wu*, Dehui Xu, Bin Xiong, and Yuelin Wang, “A high performance bulk mode single crystal silicon microresonator based on a cavity-SOI wafer,” J. Micromech. Microeng., vol. 22, no. 2, 025020, Feb. 2012. (SCI, IF: 1.794)

Guoqiang Wu*, Dehui Xu, Bin Xiong, and Yuelin Wang, “A high Q micromachined single crystal silicon bulk mode resonator with pre-etched cavity,” Microsyst. Technol., vol. 18, no. 1, pp. 25-30, Jan. 2012. (SCI, IF: 1.195)

Nan Wang, Jinghui Xu, Xiaolin Zhang, Guoqiang Wu, Yao Zhu, Wei Li, and Yuandong Gu, “Methods for precisely controlling the residual stress and temperature coefficient of the frequency of a MEMS resonator based on an AlN cavity silicon-on-insulator platform,” J. Micromech. Microeng., vol. 26, no. 7, pp. 074003, May, 2016. (SCI, IF: 1.794)

Yuzhao Wang, Yong Xie, Tianlei Zhang, Guoqiang Wu, Gang Wang, and Caijia Yu, “Quality factor measurement for MEMS resonator using time-domain amplitude decaying method,” Microsyst. Technol., vol. 21, no. 4, pp. 825-829, Apr. 2014. (SCI, IF: 1.195)

Duan Feng, Dehui Xu, Guoqiang Wu, Bin Xiong, and Yuelin Wang, “Phononic crystal strip based anchors for reducing anchor loss of micromechanical resonators,”J. Appl. Phys.,vol. 115, no. 2, p. 024503, Jan. 2014. (SCI, IF: 2.068)

Duan Feng, Dehui Xu, Guoqiang Wu, Bin Xiong, and Yuelin Wang,  “Extending of band gaps in silicon based one-dimensional phononic crystal strips,” Appl. Phys. Lett., vol. 103, no. 15, p. 151906, Oct. 2013. (SCI, IF: 3.411)

Xiao Sun, Dehui Xu, Bin Xiong, Guoqiang Wu, and Yuelin Wang,  “A wide measurement pressure range CMOS-MEMS based integrated thermopile vacuum gauge with an XeF₂ dry-etching process,” Sens. Actuators A, Phys., vol. 201, pp. 428-433, Oct. 2013. (SCI, IF: 2.499)

Dehui Xu, Bin Xiong, Guoqiang Wu, Yuchen Wang, Xiao Sun, and Yuelin Wang,  “Isotropic Silicon Etching With XeF₂ Gas for Wafer-Level Micromachining Applications,” J. Microelectromech. Syst., vol. 21, no. 6, pp. 1436-1444, Dec. 2012. (SCI, IF: 2.124)

Dehui Xu, Bin Xiong, Guoqiang Wu, Yinglei Ma, and Yuelin Wang, “Uncooled Thermoelectric Infrared Sensor With Advanced Micromachining,” IEEE Sensors J., vol. 12, no. 6, pp. 2014-2023, Jun. 2012. (SCI, IF: 2.512)

会议论文

Guoqiang Wu, Beibei Han, Daw Don Cheam, Peter Hyun Kee Chang, Navab Singh, and Yuandong Gu, “6-DOF Inertial Sensor Development with Advanced Fabrication Platform,” The 13^th IEEE Conference on Nano/Micro Engineered and Molecular Systems (IEEE-NEMS2018), Singapore, Apr. 22-26, 2018.

Beibei Han, Guoqiang Wu, Chun Lian Ong, Daw Don Cheam, Peter Hyun Kee Chang, and Yuandong Gu, “Development of Monolithic 3-Axial Accelerometer on 6-DOF TSV Encapsulated Inertial MEMS,” The 13^th IEEE Conference on Nano/Micro Engineered and Molecular Systems (IEEE-NEMS2018), Singapore, Apr. 22-26, 2018.

Guoqiang Wu, Jifang Tao, Hong Cai, Alex Yuandong Gu, “Low Loss AlN Optical Resonators for Sensing Applications,” In Proceedings of the Optofluidics 2017, July 25–28, 2017, Singapore.

Guoqiang Wu, Jinghui Xu, Xiaolin Zhang, Nan Wang, Danlei Yan, Jayce Lay Keng Lim, Yao Zhu, Wei Li, and Yuandong Gu, “High Q low impedance WLCSP resonator for sub-100 MHz programmable oscillator application,” 30^th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2017), Las Vegas, USA, pp. 913-916, Jan. 22-26, 2017.

Jing Jin, Guoqiang Wu, and Yuandong Gu, “Optimizing Spring Design of Fully Decoupled Vibrating MEMS Gyroscope,” The International Conference on Engineering and Applied Sciences (TICEAS), Singapore, Feb. 21-23, 2017. (Student paper)

Guoqiang Wu, Dehui Xu, Bin Xiong, and Yuelin Wang, “A micromachined square extensional mode resonant magnetometer with directly voltage output,” 26^th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2013), Taipei, Taiwan, pp. 633-636, Jan. 20-24, 2013.

Guoqiang Wu, Dehui Xu, Bin Xiong, and Yuelin Wang, “Wheatstone bridge arrangement based piezoresistive sensing for bulk mode micromechanical resonator,” JCK MEMS/NEMS 2012, Shanghai, China, Sep. 22-24, 2012.

Guoqiang Wu, Dehui Xu, Bin Xiong, Errong Jing, and Yuelin Wang, “Wafer Level Vacuum Packaged Resonator with In-situ Au-Al Eutectic Re-Distribution Layer,” IEEE Sensors 2012, Taipei, Taiwan, Oct. 28-31, 2012.

Guoqiang Wu, Dehui Xu, Bin Xiong, and Yuelin Wang, “A Wafer Level Vacuum Packaging for MEMS Using Glass Frit Bonding,” 3^rd International Conference of the Chinese Society of Micro-Nano Technology, Hangzhou, China, Nov. 4-7, 2012.

Guoqiang Wu, Dehui Xu, Bin Xiong, Yinglei Ma, Yuelin Wang, and Errong Jing, “Analysis of Air Damping in Micromachined Resonators,” The 7^th IEEE Conference on Nano/Micro Engineered and Molecular Systems (IEEE-NEMS 2012), Kyoto, Japan, pp. 610-613, Mar. 5-8, 2012.

Guoqiang Wu, Dehui Xu, Bin Xiong, and Yuelin Wang, “Micromachined Single Crystal Silicon Bulk Mode Resonator with Pre-etched Cavity,” 2^nd International Conference of the Chinese Society of Micro-Nano Technology, Xi’an, China, Oct. 22-24, 2010.

Dehui Xu, Bin Xiong, Guoqiang Wu, Yinglei Ma, Errong Jing, and Yuelin Wang, “3D Monolithic Integrated Thermoelectric IR Sensor,” IEEE Sensors 2012, Taipei, Taiwan, Oct. 28-31, 2012.

Dehui Xu, Bin Xiong, Errong Jing, Guoqiang Wu, and Yuelin Wang, “Thermopile IR Detector with Filter Cointegrated by Wafer Bonding Technique,” The 24^th IEEE International Conference on Micro Electro Mechanical Systems (IEEE-MEMS 2011), Cancun, Mexico, pp. 724-727, Jan. 23-27, 2011.

Dehui Xu, Bin Xiong, Guoqiang Wu, Yinglei Ma, Yuelin Wang, and Errong Jing, “Characterization Of Wafer-level XeF₂ Gas-phase Isotropic Etching For MEMS Processing,” The 7^th IEEE Conference on Nano/Micro Engineered and Molecular Systems (IEEE-NEMS2012), Kyoto, Japan, pp. 356-359, Mar. 5-8, 2012.

发明专利

CN101917174B，亚微米间隙结构的制作方法及其制作的微机械谐振器，中国，2013

CN101867080B，一种体硅微机械谐振器及制作方法，中国，2013

CN102122935B，一种具有亚微米间隙的微机械谐振器及制作方法，中国，2013

CN102645565B，一种微机械磁场传感器及其制备方法，中国，2014

CN102680917B，一种微机械磁场传感器及其制备方法，中国，2014

CN102914749B，微机械磁场传感器及其应用，中国，2014

CN102509844B，一种微机械圆盘谐振器及制作方法，中国，2015

CN102928793B，微机械磁场传感器及其应用，中国，2015

CN102914750B，微机械磁场传感器及其应用，中国，2015

CN102674240B，一种微机械传感器及其制作方法，中国，2015

CN102868384B，微机械谐振器，中国，2015

201210041259，热绝缘微结构及其制备方法，中国，2012

201210382727，自锁圆片键合结构及制作方法，中国，2012

WO2017135891A1，Gyroscope Devices and Methods for Fabricating Gyroscope Devices，国际，2017

WO2017138884A1，Optical Gyroscope, Electro-Optic System and Methods of Forming the Same，国际，2017

WO2017048189A1，Bolometer, method of fabrication the same, and bolometric method，国际，2017.03

SG 10201706910R，Integrated Opto-Mechanics Gyroscope，新加坡，2017

所获荣誉

新加坡科技局-新加坡国防部优秀合作项目

获奖题目：High Grade MEMS Gyroscope Development

2014年上海市研究生优秀成果（学位论文）（省市级）

获奖题目：Cavity-SOI单晶硅体模态微机械谐振器及其应用的研究

中国科学院院长优秀奖（2013）

西安电子科技大学优秀毕业生（2008）